DSC_0050

3D Computed Tomography Operation

3D Computed Tomography Operation

Printed Circuit Board

With both transmission and reflection targets, KARS' is able to resolve features down to 10μm. PCB Vias, BGA cracking, and bond wire failures can be analyzed by professional engineers.

MultilayerPCB 3D Rendering

With Volume Graphics Software, 3D renderings of complex parts can be shown with density and scaled dimensional information.

18650 Battery Cutaway

Using 3D rendering software allows for virtual slices and filtering based on material density from any orientation.

Section B - middle Recovered (128um) 1

Materials can be analyzed for entrapped air, cracks, layup angle, void volume fraction, and regrind.

Materials can be analyzed for entrapped air, cracks, layup angle, void volume fraction, and regrind.

Materials can be analyzed for entrapped air, cracks, layup angle, void volume fraction, and regrind.

previous arrow
next arrow

3D Computed Tomography is a non destructive test method that allows one to examine external and internal features of virtually any component.  The laboratory provides 2D Digital X-ray Radiography and 3D Computed Tomography services for our clients.  We utilize a Nikon XT H 225 ST with a 1620 Perkin Elmer panel.  NIST traceable artifacts are used on our scans for precise and accurate measurements.